encapsulating material造句
例句與造句
- Based on the over research , three different kinds of encapsulating materials of epoxy resin are performed
在各種不同制備方法研究的基礎(chǔ)上，選用不同的改性體系制備出環(huán)氧灌封材料，并對其性能作了評價。 - There are some differences between simulation and experiment results in the patterns " distribution scale for there are still some conditions " differences just as characteristics of encapsulated materials and shapes of encapsulated structure
Led結(jié)構(gòu)的參數(shù)變化時，模擬曲線的變化趨勢與實驗情況吻合較好。其中存在的不同和誤差必需根據(jù)led管型的真實參數(shù)適當調(diào)整模擬參數(shù)和條件解決，有待進一步改進。 - In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with 13 refs
摘要結(jié)合電子封裝的現(xiàn)狀、電子塑封材料的發(fā)展以及電子封裝對塑封材料提出的高性能要求，介紹了新型脂環(huán)族環(huán)氧樹脂及其作為塑封材料的應用前景，其包括耐熱型液體、含磷三官能團型、有機硅多官能團脂環(huán)族環(huán)氧樹脂。 - Encapsulating materials of epoxy resin are modified with hgh , nano - sio2 and organophilic montmorillonite , in the present investigation , the microstructue , some properties and influence factors about nano - sio2 and organophilic montmorillonite modified encapsulatig materials have been systematically studied using x - ray diffraction , electron microscopy and differential thermal analysis measurement techniques
隨著航空、電子等事業(yè)的發(fā)展，灌封器件的高性能化對灌封材料提出了越來越高的要求。探索制備環(huán)氧灌封材料的新方法，尋求提高其使用性能的有效途徑是該領(lǐng)域研究的重要課題。 - This paper mainly described the research on rheological property , high thermal stability , flame retardant , the influence of catalyst and insulating heat conduction of organic silicon encapsulating materials , which greatly apply on electronic equipment and large scale integrated circuit and so forth
摘要本文主要綜述了國內(nèi)外用于電子元器件、大規(guī)模集成電路等高科技領(lǐng)域的有機硅灌封材料在流動、耐高溫、阻燃和絕緣導熱等方面的性能以及催化劑對灌封材料的影響的研究應用進展。 - It's difficult to find encapsulating material in a sentence. 用encapsulating material造句挺難的
- Test results show that that the breakcown voltage and heat distortion temperature the encapsulating materials of epoxy resin with hgh are famously improved , but the the addition of hgh , the viscosities of the epoxy resin - hgh system is higher compared with that of the others and the encapsulating process is effected . nano - sio2 improves the mechanical properties of encapsulating materials of epoxy resin , impact strength reaches 27 . 64kj / m2 from 13 . 95 kj / m2 , flexural strength reaches 136 . 68mpa from64 . 95 mpa . by addition of the montmorillonite , glass transition temperature and heat distortion temperature of the encapsulating materials are 13 . 2 and 16 higher than that of epoxy re
結(jié)果表明，活性硅微粉對環(huán)氧灌封材料的熱變形溫度和電學性能提高較為顯著，尤其在浸水后，電學性能降低幅度很小，西北工業(yè)大學碩士學位論文但活性硅微粉用量較大，材料的工藝性能明顯降低;納米5102對環(huán)氧灌封材料具有顯著的增強和增韌作用，沖擊強度、彎曲強度由原來的13 . 95kj / mz和64 . 95mpa分別提高到27 . 64kjzm2和136 . 68mpa 。